Printed Circuit Boards (PCB)

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PRINTED CIRCUIT BOARDS (PCB)

PRODUCTS & TECHNOLOGIES

PRODUCT MIX

Multilayer

up to 42 layers
Impedance control possible

IMS

with aluminium or copper core
various types in stock

Double- and single sided

with or without through-hole plating
super-fast production time from 8 hours

Ultra-Fine Conductor

50µm Line & 30µm Space
CU/Hole Offset < 10µm

HF-Boards

High-frequency materials (Rogers, Taconic, ..)
various ceramics and teflon substrates in stock

Semiflex

for single bending
Flex part is created by CNC technology

Probecards

up to 6mm thick
up to 42 layers

HDI

stacked Vias, Anylayer
Blind-Burried Stackups

TECHNOLOGy-ROADMAP

OPTIONS

SURFACES

  • HAL Pb-Free
  • chem. Sn.
  • galv. NiAu
  • ENTEK
  • ENIG
  • ENEPIG
  • ENEPIG (thick layer PD)
  • ENEP
  • Selektiv galv. Au
  • EP

SOLDERMASK/SILKSCREEN

Green

White

Red

Blue

Black

Materials

We have a variety of materials for various applications in stock. We are also happy to procure the material of your choice or process the material provided – please contact our technical support for further information.

FR4-Standard
(TG < 150)

  • MC100 (Panasonic)
  • R1755C (Panasonic)

High-TG
(TG 180)

  • PCL370HR (ISOLA)

Super HIGH-TG
(TG > 200)

  • FR408 (ISOLA)
  • P96 (ISOLA)
  • VT901 (VENTEC)

HIGH FREQUENCY
(Keramik, Teflon, ..)

  • MEGTRON 6 (PANASONIC)
  • MEGTRON 4 (PANASONIC)
  • TLE95 (TACONIC)
  • Rogers4350B (ROGERS)

cycle resistant
(Automotive)

  • R1566W (Panasonic)

IMS
(ALU/CU)

  • VT-4B3 (VENTEC)
  • VT-4B5 (VENTEC)
  • VT-4B7 (VENTEC)
  • VT-4A1 (VENTEC)
  • VT-4A2 (VENTEC)
  • HPL (Bergquist)
  • HT (Bergquist)

special technologies

  • Edge Plating
  • Slot holes (plated/non-plated)
  • Depth milling
  • Backdrilling
  • Viafill
  • Plugging
  • CCD-Measurement incl.
    measurement protocol
  • Impedance measurement