{"id":12,"date":"2017-12-03T11:04:13","date_gmt":"2017-12-03T11:04:13","guid":{"rendered":"https:\/\/piumail.piu-printex.at\/wordpress\/?page_id=12"},"modified":"2019-08-12T11:33:28","modified_gmt":"2019-08-12T09:33:28","slug":"design-hilfe","status":"publish","type":"page","link":"https:\/\/piumail.piu-printex.at\/wordpress\/design-hilfe\/","title":{"rendered":"Design-Hilfe"},"content":{"rendered":"\t\t
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Designhilfe<\/h2>\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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THEMENGEBIETE\n<\/h3>\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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\n\t\t\t\tDieser Abschnitt ist im Moment in Bearbeitung. In Zukunft erhalten Sie hier Hilfestellungen zu diversen Leiterplatten-Themen.

zur alten Design-Hilfe<\/a>\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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\"\"<\/figure>

Oberfl\u00e4che<\/h3>

Eigenschaften und Einsatzm\u00f6glichkeiten
der Endoberfl\u00e4chen<\/a>
\n\n\n\n\n\n<\/p><\/div><\/div>\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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Bohren & Durchkontaktieren<\/h3>

Blind and Burried Vias<\/a>
\n\nSide-Plating<\/a>
\n\nVia ind Pad<\/a>
\n\nHalbl\u00f6cher<\/a>
\n\nDurchkontaktierte Schlitze<\/a>
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Innenlagen<\/h3>

Lagenorientierung<\/a>
\n\nKupfer-Balance<\/a>
\n\nClearance<\/a>
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\"\"<\/figure>

Materialien<\/h3>

Lagernde Materalien<\/a>
\n\nHochfrequenz-Anwendungen<\/a>
\n\n CAF-best\u00e4ndige Materialien<\/a>
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\"\"<\/figure>

Mechanik<\/h3>

Fr\u00e4sen<\/a>
\n\nRitzen<\/a>
\n\nBackdrilling<\/a>
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Lagenaufbau<\/h3>

Impedanzkalkulation<\/a>
\n\nCores, Prepregs und sonstige Laminate<\/a>
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\"\"<\/figure>

Oberfl\u00e4che<\/h3>

Endoberfl\u00e4che<\/a>
\n\nVia-Abdeckung<\/a>
\n\nLeiterbahnbreite<\/a>
\n\nAbst\u00e4nde und Kuperrestring<\/a>
\n\nL\u00f6tstoppmaske<\/a>
\n\nBauteilaufdruck<\/a>
\n\n<\/p><\/div><\/div>\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"

Designhilfe THEMENGEBIETE Dieser Abschnitt ist im Moment in Bearbeitung. In Zukunft erhalten Sie hier Hilfestellungen zu diversen Leiterplatten-Themen. zur alten Design-Hilfe Oberfl\u00e4che Eigenschaften und Einsatzm\u00f6glichkeitender Endoberfl\u00e4chen Bohren & Durchkontaktieren Blind and Burried Vias Side-Plating Via ind Pad Halbl\u00f6cher Durchkontaktierte Schlitze Innenlagen Lagenorientierung Kupfer-Balance Clearance Materialien Lagernde Materalien Hochfrequenz-Anwendungen CAF-best\u00e4ndige Materialien Mechanik Fr\u00e4sen Ritzen Backdrilling Lagenaufbau […]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":[],"yoast_head":"\nDesign-Hilfe » PIU-PRINTEX<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/piumail.piu-printex.at\/wordpress\/design-hilfe\/\" \/>\n<meta property=\"og:locale\" content=\"de_DE\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Design-Hilfe » PIU-PRINTEX\" \/>\n<meta property=\"og:description\" content=\"Designhilfe THEMENGEBIETE Dieser Abschnitt ist im Moment in Bearbeitung. 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