{"id":1156,"date":"2019-10-26T17:05:08","date_gmt":"2019-10-26T15:05:08","guid":{"rendered":"https:\/\/piumail.piu-printex.at\/wordpress\/?page_id=1156"},"modified":"2019-10-28T09:32:20","modified_gmt":"2019-10-28T08:32:20","slug":"design-support","status":"publish","type":"page","link":"https:\/\/piumail.piu-printex.at\/wordpress\/en\/design-support\/","title":{"rendered":"Design Support"},"content":{"rendered":"\t\t
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Design Support<\/h2>\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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THEME FIELDS<\/h3>\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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This section is currently under construction. In the future, you will find help on various printed circuit board topics here.<\/p>\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t

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\"\"<\/figure>

Surface<\/h3>

Properties and applications
of the final surfaces<\/a>
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Bohren & Durchkontaktieren<\/h3>

Blind and Burried Vias<\/a>
\n\nSide-Plating<\/a>
\n\nVia ind Pad<\/a>
\n\nHalbl\u00f6cher<\/a>
\n\nDurchkontaktierte Schlitze<\/a>
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Innenlagen<\/h3>

Lagenorientierung<\/a>
\n\nKupfer-Balance<\/a>
\n\nClearance<\/a>
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\"\"<\/figure>

Materialien<\/h3>

Lagernde Materalien<\/a>
\n\nHochfrequenz-Anwendungen<\/a>
\n\n CAF-best\u00e4ndige Materialien<\/a>
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\"\"<\/figure>

Mechanik<\/h3>

Fr\u00e4sen<\/a>
\n\nRitzen<\/a>
\n\nBackdrilling<\/a>
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Lagenaufbau<\/h3>

Impedanzkalkulation<\/a>
\n\nCores, Prepregs und sonstige Laminate<\/a>
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\"\"<\/figure>

Oberfl\u00e4che<\/h3>

Endoberfl\u00e4che<\/a>
\n\nVia-Abdeckung<\/a>
\n\nLeiterbahnbreite<\/a>
\n\nAbst\u00e4nde und Kuperrestring<\/a>
\n\nL\u00f6tstoppmaske<\/a>
\n\nBauteilaufdruck<\/a>
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Design Support THEME FIELDS This section is currently under construction. In the future, you will find help on various printed circuit board topics here. Surface Properties and applicationsof the final surfaces Bohren & Durchkontaktieren Blind and Burried Vias Side-Plating Via ind Pad Halbl\u00f6cher Durchkontaktierte Schlitze Innenlagen Lagenorientierung Kupfer-Balance Clearance Materialien Lagernde Materalien Hochfrequenz-Anwendungen CAF-best\u00e4ndige Materialien […]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":[],"yoast_head":"\nDesign Support » PIU-PRINTEX<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/piumail.piu-printex.at\/wordpress\/en\/design-support\/\" \/>\n<meta property=\"og:locale\" content=\"de_DE\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Design Support » PIU-PRINTEX\" \/>\n<meta property=\"og:description\" content=\"Design Support THEME FIELDS This section is currently under construction. In the future, you will find help on various printed circuit board topics here. 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